Removable heat resistant adhesive tape of coating an adhesive on polyimide film.
Usable as masking tape for solder reflow process.
Able to de-tape without adhesive residue even after pressing at 200℃, therefore, products are usable for protection of terminals, processing of cabity, or during components enbedding in multilayer substrate.
Silicone free tape, no concern from silicone contamination. |
