FPC Materials

Materials consist of polyimide films and electrical insulation adhesive layer(s), made by lamination.
Applicable as stiffner for connector.

Removable heat resistant adhesive tape made by coating an adhesive on polyimide film. Usable as masking tape for the solder reflow process. Able to be de-taped without adhesive residue even after pressing at 200℃, therefore, products are usable for protection of terminals, processing of cavities, or when embedding components in multilayer substrate. Silicone free tape, no danger of silicone contamination.

Materials of impregnation of glass cloth with epoxy resin, and semi- cured/cured.
Applicable as a base material for things such as an IC terminal mounted on SIM cards.
The products have high heat resistance, dimensional stability and electrical insulation.
Roll-to-roll workable (products can be supplied in a roll).
Thermosetting adhesive or pressure sensitive adhesive can be coated on the surface of product on/at customer request.