Bonding sheet of having good insulation resistance and adhesion properties.
Various lineups for applications such as for multilayer FPC, high-speed transmission, bonding of stiffner.

Grade	UL94	Characteristics	Doc
AU type	✔	Standard type. Excellent in adhesion and workability.	ダウンロード
AED S type	✔	Good flame reterdancy and ion-migration prevention. (L/S=30/30)	ダウンロード
A11F type	✔	High solder heat resistance (320℃)	ダウンロード
AE15 type	✔	Good ion-migration prevention. (L/S=20/20)	ダウンロード
AE91 type	To be applied	Good flame reterdancy, ion-migration prevention. (L/S=20/20), and workability by quick-press.	ダウンロード
A27 type	✔	Applicable to high-speed transmission requirement. Low Dk (Dk:2.34), Low Df (Df:0.0013).	ダウンロード
AE17 type	To be applied	High solder heat resistance (320℃) Excellent in ion-migration prevention (L/S=20/20).	ダウンロード
AAL type AAC type	-	Good adhesion. Tacky type (for bonding of stiffner)
AAK type AAP type	-	Good adhesion. Tackless type (for bonding of stiffner)

Bonding sheet for heat radiation purpose

Bonding sheet having superior ability in heat radiation and insulation.
Structure of copper clad laminate type (RCC) is also available.
Applicable as thermal conductive insulation adhesive sheet for such as LED and power module.

Grade	UL94	Characteristics	Doc
EAL type	✔	Thermal conductivity : equivalent to 1W/m⋅k. Low Tg type.
EAF type	-	Thermal conductivity : equivalent to 1W/m⋅k. High Tg type.	ダウンロード
EAJ type	-	Thermal conductivity : equivalent to 3W/m⋅k	ダウンロード
EAH type	-	Thermal conductivity : equivalent to 10W/m⋅k
EAM type	-	Thermal conductivity : equivalent to 15W/m⋅k	ダウンロード

Bond ply

Bonding sheet specialized for the insulation resistance between layers, and contribute to thining multi-layer products.
Applicable to multi-layered FPC.

Grade	UL94	Characteristics
CV type	-	Standard type with good workability. (Halogen contains)
CM type	-	Standard type. Halogen-free. Good insulation performance.