Grade |
UL94 |
Characteristics |
Doc |
AU |
✔ |
Standard type. Excellent in adhesion and workability. |
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|
AED S |
✔ |
Good flame reterdancy and ion-migration suppression. (L/S=30/30) |
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|
A11F |
✔ |
High solder heat resistance (320℃) |
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|
AE15 |
✔ |
Good ion-migration suppression. (L/S=20/20) |
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|
AE91 M |
To be applied |
Good flame reterdancy, ion-migration suppression. (L/S=20/20),
and processability by quick-press. |
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|
A35F |
✔ |
Applicable to high-speed transmission requirement.
Low Dk (Dk:2.32), Low Df (Df:0.0014). |
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|
AE17 |
✔ |
High solder heat resistance (320℃)
Excellent in ion-migration suppression (L/S=20/20). |
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|
AAL
AAC |
- |
Good adhesion. Tacky type (for bonding of stiffner) |
|
AAK
AAP |
- |
Good adhesion. Tackless type (for bonding of stiffner) |
|