Various lineups for applications such as smart devices (smartphone and tablets), laptop, HDD.
[Adhesiveless double-sided]
Material of laminating the copper foil on Polyimide film.
[Adhesiveless single-sided]
Material of coating PI on copper foil.
Grade
Structure
UL94
Characteristics
Doc
PKRW series
Double-sided
✔
Excellent in solder heat resistance after hydrothermal
treatment.
Excellent in dimensional stability.
Materials consist of composite insulation layer made of fluorine resin and polyimide resin.
With superior dielectric property of fluorine resin, materials are compatible with requirement of millimeter wave band higher than 28GHz.
Good adhesion to low roughness coper foil (Rz≤0.8µm).
Insulation layer thicknes of 50µm or thicker is also available.
Grade
Structure
UL94
Characteristics
Doc
FC series
Double-sided
Single-sided
✔
Excellent in dielectric property (Dk 2.5, Df≤0.002,
Millimeter wave band compatible product).
High adhesion (adhesion to low roughness copper foil:
≥10N/cm).
Low water absorption (<0.2%).
Materials consists of electrical insulation adhesive, polyimide film and copper foil(s), made by lamination method.
There are lineups dedicated for mobile phone or HDD with a wide range of adption records.
Grade
Structure
UL94
Characteristics
Doc
L72 series
Double-sided
Single-sided
✔
Transparent adhesive. Excellent in heat resistance.