ARISAWA Mfg.Co.,Ltd
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FPC Materials
Cover lay
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-Film lamination
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TECHNOLOGIES & PRODUCTSP

FPC Materials

The raw materials of printed circuit board, the key device in the information and communication society, are developed and produced in our business segment for electronics materials with the four core technologies described below.
1. The surface treatment technology that makes glass cloths show the best performance
2. The blending technology that combines various types of modifier and chemical to various types of thermosetting resin
3. The resin coating technology
4. The laminate technology
Our products spread in the entire field of materials used in printed circuits, fore example, from prepreg material for rigid PWB(printed wiring boards) to FPC(Flexible Printed Circuit).
The customers' reliance on Ariswa is based on the supremacy in the performance, for example, flex resistance at high temperature and with extremely narrow gap, anti-migration property, and thermal durability, and on the evaluation technology in the production process at customers' sites.
Our products and services have a long successful track record that places us at the top of the industry!

 

Products Information

  • Coverlay
  • Products lineup based on adhesives for various applications.Various types of films with a wide range of thickness are available.
    • PI type
    • Photosensitive type
    • Other

  • Copper-clad laminate
  • 3 layer type has a product lineup based on various types of PI films and adhesives for various applications.
    Casting, and laminating methods are adopted for the single-sided, and the double-sided FCCLs, respectively.
    • 2 layer (adhesive-less) type
    • 3 layer type

  • Interlayer adhesive sheet
  • Glass epoxy prepreg, adhesive itself, double-sided adhesive coated etc are available for various applications and with various compositions.
    • Glass epoxy prepreg
    • Bonding sheet
    • Bond ply
    • Bonding sheet for heat radiation purpose

  • Others
  • Particular products based on our technologies, such as mixing, coating, and laminating are also available.
    • PI Composite film (Stiffner)
    • Protection film

 

Contacts

For inquiries to Business Promotion Division
     Sales & Marketing Department
Electronic Materials Sales Group 1 (Tokyo Head Office)
TEL: +81-(0)3-3861-3562
FAX: +81-(0)3-3861-2140
E-mail: fpc-t@arisawa.co.jp
Electronic Materials Sales Group 1 (Kansai Sales Office)
TEL: +81-(0)6-4703-3168
FAX: +81-(0)6-4703-3169
E-mail: fpc-o@arisawa.co.jp
Electronic Materials Sales Group 2
TEL: +81-(0)3-3861-3509
FAX: +81-(0)3-3861-2140
E-mail: circuit@arisawa.co.jp
 
ARISAWA Mfg.Co.,Ltd
Top Page
Technologies & Products
Technologies & Products
  • FPC Materials

    Coverlay

    Copper Clad Laminate

    Adhesive sheet

    Others

  • Optical Materials

    Projection Screen

    UV Nanoimprinting

    3D Product

    Optical retardation element

    Lamination process-Film lamination

    Lamination process-Glass lamination

  • Electrical Insulating / Industrial Structural Materials

    Fabric Products

    General Coating Products

    Industrial Structural Materials

  • Thechnology

    Weaving

    Coating

    Molding

  • Glossary
  • Products News
  • Technologies & Products
Analysis service
Analysis service
  • Analysis service menu (Case Example)

    ISO/IEC17025 Accredited Laboratory

    Analytical Equipments

       
Company
Company
  • Company Profile

    Message from Representative Director

    Organization chart

    Business Establishment

    Associated Companies

    History

IR/Financial
IR/Financial
  • IR/Financial

    Financial Highlights

    IR Library

    IR Calendar

    Analyst Coverage

    IR News

Sustainability
Sustainability
  • Sustainability Management

    Environmental Initiatives

    Social Relations

    CSR News

News List
Recruit
Recruit
  • Recruit Message

    Recruit Inquiry

  • CONTACTS
Arisawa Mfg. Co., Ltd.

Head Office

Minami-honcho 1-5-5, Joetsu-shi, Niigata-ken

TEL:+81-(0)25-524-5121/FAX:+81-(0)25-524-1117

© Arisawa Manufacturing Co., Ltd.