Raw materials of printed circuit boards, one of the key device in the the digital world, are developed and produced in our electronics materials segment with the four core technologies described below.
　1. Surface treatment technology that provides glass cloths the best performance.
　2. Blending technology that combines various types of modifiers and chemicals to various types of thermosetting resin.
　3. Resin coating technology.
　4. Laminate technology.
Our electronic materials are widely used in PWB (Printed Wiring Boards) and FPC (Flexible Printed Circuits).
Customers' reliance on Arisawa products is based on superior performance , such as flex resistance at high temperature and with extremely narrow gap, ion migration suppression, and thermal durability, and also based on evaluation technology in the production.
Our products and services have a long successful track record that places us at the top of the industry!

Products Information

Coverlay
Arisawa has a wide ranging lineup of coverlay films for various applications. Products are composed of base films (different types and thicknesses) and uniquely characterized adhesives.

Copper-clad laminate
3 layer FCCL: There is a lineup of products composed of different PI films as a base material with unique adhesives depending on the application.
Adhesiveless FCCL: For single-sided products, the casting method is adopted, and the laminating method for double-sided products.

Interlayer adhesive sheet
Uniquely characterized adhesive sheets and bondplys are available for various applications.

Others
Arisawa also has lineups of special products made with our technologies such as resin mixing, coating and lamination.

Contacts

For inquiries to Business Promotion Division Sales & Marketing Department
	Electronic Materials Sales Group 1 (Tokyo Head Office)
		TEL:	+81-(0)3-3861-3562
		FAX:	+81-(0)3-3861-2140
		E-mail:	fpc-t@arisawa.co.jp
	Electronic Materials Sales Group 1 (Kansai Sales Office)
		TEL:	+81-(0)6-4703-3168
		FAX:	+81-(0)6-4703-3169
		E-mail:	fpc-o@arisawa.co.jp
	Electronic Materials Sales Group 2 (Tokyo Head Office)
		TEL:	+81-(0)3-3861-3509
		FAX:	+81-(0)3-3861-2140
		E-mail:	circuit@arisawa.co.jp