ARISAWA Mfg.Co.,Ltd

JapaneseSitemap
Search
  • HOME
  • COMPANY
  • TECHNOLOGIES & PRODUCTS
  • IR/FINANCIAL
  • ANALYSIS SERVICE
  • CSR
  • RECRUIT
  • CONTACTS
Products
Products news
FPC Materials
Cover lay
Copper Clad Laminate
Adhesive sheet
Others
Contacts
Optical Materials
Projection Screen
UV Nanoimprinting
3D Product
Optical retardation element
Lamination process
-Film lamination
Lamination process
-Glass lamination
Contacts
Electical Insulating / Industrial Structural Materials
Fabric Products
General Coating Products
Industrial Structural
Materials
Contacts

TECHNOLOGIES & PRODUCTS


FPC Materials

Others

  Polyimide Composite film

Material of laminating Polyimide film with the insulation adhesive.
Applicable as stiffner for connector.


Grade UL94 Characteristics
FN type ✔ Alternative for thick polyimide film.



  Protection film

Removable heat resistant adhesive tape of coating an adhesive on polyimide film. Usable as masking tape for solder reflow process. Able to de-tape without adhesive residue even after pressing at 200℃, therefore, products are usable for protection of terminals, processing of cabity, or during components enbedding in multilayer substrate. Silicone free tape, no concern from silicone contamination.


Grade UL94 Characteristics
PFE type - Tackiness free. No adhesive residue after removal.
PFG type - Low tackiness. No adhesive residue after removal.
PFR type - Tacky. No adhesive residue after removal.




line

PAGE TOP
Copyright(C)2011 Arisawa Manufacturing Co., Ltd. All Rights Reserved.