| Grade | 
UL94 | 
Characteristics | 
      Doc | 
    
| AU | 
✔ | 
Standard type. Excellent in adhesion and workability. | 
      
      
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| AED S | 
✔ | 
Good flame reterdancy and ion-migration suppression. (L/S=30/30) | 
      
      
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| A11F | 
✔ | 
High solder heat resistance (320℃) | 
      
      
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| AE15 | 
✔ | 
Good ion-migration suppression. (L/S=20/20) | 
      
      
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| AE91 M | 
To be applied | 
Good flame reterdancy, ion-migration suppression. (L/S=20/20), 
and processability by quick-press. | 
      
      
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| A35F | 
✔ | 
Applicable to high-speed transmission requirement. 
Low Dk (Dk:2.32), Low Df (Df:0.0014). | 
      
      
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| AE17 | 
✔ | 
High solder heat resistance (320℃) 
Excellent in ion-migration suppression (L/S=20/20).  | 
      
      
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AAL 
AAC | 
- | 
Good adhesion. Tacky type (for bonding of stiffner) | 
      
      
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AAK 
AAP | 
- | 
Good adhesion. Tackless type (for bonding of stiffner) | 
      
      
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