ARISAWA Mfg.Co.,Ltd

JapaneseSitemap
Search
  • HOME
  • COMPANY
  • TECHNOLOGIES & PRODUCTS
  • IR/FINANCIAL
  • ANALYSIS SERVICE
  • CSR
  • RECRUIT
  • CONTACTS
Products
Products news
FPC Materials
Cover lay
Copper Clad Laminate
Adhesive sheet
Others
Contacts
Optical Materials
Projection Screen
UV Nanoimprinting
3D Product
Optical retardation element
Lamination process
-Film lamination
Lamination process
-Glass lamination
Contacts
Electical Insulating / Industrial Structural Materials
Fabric Products
General Coating Products
Industrial Structural
Materials
Contacts

TECHNOLOGIES & PRODUCTS


FPC Materials

line


The raw materials of printed circuit board, the key device in the information and communication society, are developed and produced in our business segment for electronics materials with the four core technologies described below.
1. The surface treatment technology that makes glass cloths show the best performance
2. The blending technology that combines various types of modifier and chemical to various types of thermosetting resin
3. The resin coating technology
4. The laminate technology
Our products spread in the entire field of materials used in printed circuits, fore example, from prepreg material for rigid PWB(printed wiring boards) to FPC(Flexible Printed Circuit).
The customers' reliance on Ariswa is based on the supremacy in the performance, for example, flex resistance at high temperature and with extremely narrow gap, anti-migration property, and thermal durability, and on the evaluation technology in the production process at customers' sites.
Our products and services have a long successful track record that places us at the top of the industry!

 

Products informationline

  • Coverlay
  • Products lineup based on adhesives for various applications.Various types of films with a wide range of thickness are available.
    • PI type
    • Photosensitive type
    • Other

  • Copper-clad laminate
  • 3 layer type has a product lineup based on various types of PI films and adhesives for various applications.
    Casting, and laminating methods are adopted for the single-sided, and the double-sided FCCLs, respectively.
    • 2 layer (adhesive-less) type
    • 3 layer type

  • Interlayer adhesive sheet
  • Glass epoxy prepreg, adhesive itself, double-sided adhesive coated etc are available for various applications and with various compositions.
    • Glass epoxy prepreg
    • Bonding sheet
    • Bond ply
    • Bonding sheet for heat radiation purpose

  • Others
  • Particular products based on our technologies, such as mixing, coating, and laminating are also available.
    • PI Composite film (Stiffner)
    • Protection film

 

Contactsline


iconFor inquiries to Electronic Materials Business Division
     Sales & Marketing Department
  Electronic Materials Sales Group 1 / Electronic Materials Sales Group 2 (Tokyo Branch)
    TEL: +81-(0)3-3861-3562
    FAX: +81-(0)3-3861-2140
    E-mail: tpc-t@arisawa.co.jp
 
  Electronic Materials Sales Group 1 (Kansai Sales Office)
    TEL: +81-(0)6-4703-3168
    FAX: +81-(0)6-4703-3169
    E-mail: tpc-o@arisawa.co.jp
 
  Electronic Materials Sales Group 3
    TEL: +81-(0)3-3861-3509
    FAX: +81-(0)3-3861-2140
    E-mail: circuit@arisawa.co.jp
 

line

PAGE TOP
Copyright(C)2011 Arisawa Manufacturing Co., Ltd. All Rights Reserved.